Bonding

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Bonding

A background check on a potential employee, followed by the procurement of insurance against any theft from the company that the employee may commit. Some financial service or other companies whose employees handle large amounts of cash conduct this process. The United States Department of Labor runs the Federal Bonding Program, which issues bonds insuring or guaranteeing the insurance of ex-offenders whose employment adds significant risk of theft or fraud.
References in periodicals archive ?
Porcelain laminates are also less likely to chip or stain--the two faults of direct bonding.
We believe that Ziptronix's patented direct bonding technology enables the industry's best performance for applications such as 3D memory, BSI image sensors and a developing host of other applications," said Dan Donabedian, CEO of Ziptronix.
ZOOM in-surgery whitening is available at Chapel House Dentistry for pounds 495, with the direct bonding layered system at pounds 50 per tooth.
DuPont Display Enhancements Inc declared on Thursday that the company has entered into an agreement to license its DuPont Vertak direct bonding display technology for the optical enhancement of a variety of touch panel and other display products.
The primary challenges are direct bonding between the barrier and the inner layer without the use of an applied adhesive; selection of the appropriate materials with the correct balance of performance properties; and a cost effective manufacturing process.
has signed a licensing agreement with Tezzaron Semiconductor for the use of patents regarding Ziptronix's direct bonding technologies, ZiBond[TM] and DBI[R].
Tenders are invited for Work of Ceramic tiles direct bonding on conveyor pulleys without rubber sheet/rubber pad for conveyor system in CHP D, CSTPS.
The properties of FRC reins make them well suited for various chair side applications include strength, desirable esthetic characteristics, ease of use, adaptability of various shapes, and potential for direct bonding to tooth structure.
the leading developer of direct bonding technology for advanced semiconductor applications, today announced that it has licensed its technology for a cell phone handset application.