Israel Beinglass, managing director and chief technical officer of the Transistor and Capacitor Business Group of Applied Materials, said, "We are pleased that our Implant and Epi production systems contribute to the advanced technology and high productivity of SiGen's
SOI manufacturing process.
The
SOI Industry Consortium welcomes companies, organizations, government and academic institutions to join the group in extending Moore's law scaling and applying the full benefits of
SOI-based electronics to global sustainability challenges, lowering the total cost-of-ownership of electronics and improving the quality of life.
He then instituted an annual program on tax-exempt organizations and published the only
SOI statistics to date on Individual Retirement Arrangements (for 1976 in 1980) and on employee benefit plans (for 1977 in 1982).
SOI wafers, like prime wafers, can contain yield-killing void defects at the surface of the
SOI wafer.
Advances in Technology Popularize
SOI in Commercial Markets
Following lunch, the first session, "Uses of
SOI Data in the U.
Victor Rehula began his Federal career in 1970 at the Bureau of Mines before coming to
SOI in 1972.
At the 2006 IEEE International
SOI Conference, Ray Beffa, test manager, will present a paper considering the issue of Soft Error Rates and Z-RAM.
Separation-by-IMplantation-of-OXygen (SIMOX) refers to a technique used to manufacture
SOI wafers where an oxygen implanter and an annealing process are used to create a very thin insulating layer within the wafer, just below a thin layer of silicon on the top of the wafer.
Made possible by novel hybrid strain techniques, the technology offers the performance of
SOI with the enhanced carrier mobility of strained silicon.
Renesas will expand TTRAM technology as the mainstream embedded
SOI memory IP technology.
Moreover, as our advisors are the most renowned and respected talent in both memory and
SOI technology developments, they can provide us with valuable insight into the evolving requirements of system on chip (SoC) and microprocessor developers as they scale their designs to 65nm and smaller process geometries.
