today announced that since its inception in 2002, it has shipped over 60 million
memory modules, billions of bytes of memory.
The XPG SPECTRIX D80 is the realization of the design's viability for a commercially available
memory module.
The XPG SPECTRIX D80 is the realization of the design's viability for a commercially available
memory module. For more details about product specifications and pricing, please contact your nearest ADATA XPG representative or visit www.xpg.com and lt;http://www.xpg.com and gt;
Netlist's flagship products include HyperCloudacents, a
memory module that breaks traditional memory barriers; the NVvaultacents family of products including NVvaultacents battery-free, a flash memory-based subsystem that enables data retention for weeks following a disaster, and EXPRESSvaultacents, a PCI Express backup and recovery solution for cache data protection; and a robust portfolio of high performance and specialty DIMMs including HyperStream, a low latency
memory module, and the 16GB, 4Rank, very low profile Planar-X RDIMM, which helps reduce power consumption in servers using the Company's patented Planar-X technology.
The Samsung
memory module features Pseudo Open Drain (POD) technology, which is designed to keep the power draw on DRAM circuits
According to the report, KingstonEoACAOs revenue from
memory modules was more than $2.56 billion (U.S.), giving it 45.8 percent of the total third-party
memory module market.
According to the report, Kingston's revenue from
memory modules was more than $2.85 billion, giving it 40.3 per cent of the total third-party
memory module market.
Samsung Electronics Co Ltd (Korea:005930), a specialist in memory technology, today announced that it has developed a 32 GB load reduced dual-inline
memory module (LRDIMM) designed for server applications.
Interposer support for DIMMs (The solution supports a 240-pin, 933 MHz clock (1866 MT/s data rate), 64-/72-bit, Un-buffered Synchronous Double Date Rate 3 DRAM Dual In-Line
Memory Module (DDR3 SDRAM DIMM);
The new chip paves the way for 32G Byte registered dual inline
memory module (RDIMM), in line with nine quad-die package (QDP) 16 GB DDR3s are mounted on each side of the printed circuit board for a collective 32GB, highly compact configuration.
Unfortunately, the latency of the
memory module is still determined by the characteristics of the underlying memory chips and not by the prefetch buffer.
The first step for our
memory module was to create a circuit design.