With the presence of ground, additional returns due to single and double
ground bounces are expected.
*
Ground bounce is most problematic when several signals switch at the same time or when using high-speed drivers, both common with parallel data busses.
Ground bounce arises from a dI/dt flowing through a common inductance in the return path.
Dealing with signal fidelity problems should only be attempted after
ground bounce has been tamed--because many of them will go away as a result of solving
ground bounce.
Liu, "EBG structures with fractal topologies for ultra-wideband
ground bounce noise suppression," Journal of Electromagnetic Waves and Applications, Vol.
By doing this,
ground bounce and VCC sag are avoided during switching.
When you consider all the different effects lumped under the term signal integrity, it seems like there is a neverending list of problems to keep track of:
ground bounce, ringing, crosstalk, switching noise, rail collapse, delta I noise, capacitive coupling, reflections, discontinuities, impedance miss matches, lossy lines, terminations, branches, deterministic jitter, stubs, decoupling capacitors, loop inductance, via inductance, controlled impedance, time delay, skin depth, return current, layer transitions, differential impedance, collapse of the eye, common signal termination, differential signal termination, overshoot, intersymbol interference, ring back, etc.
Also, inductance in the ground loop could induce
ground bounce problems reducing timing margins.
And boss MacLeod - who watched him for the first time in a training
ground bounce game yesterday - could offer him a deal in time for Saturday's do-or-die promotion battle against Airdrie.
For larger devices that exceed the available number of test-head resources (for example, testing a 300-pin ASIC when only 200 resources are available), or to minimize
ground bounce caused by too many simultaneous transitions, automatically split the connect test into two or more smaller tests.
(16.) "Understanding and Minimizing
Ground Bounce" Fairchild Application Note 640, February 1998.
For example, bringing the signal path closer to the return path decreases
ground bounce, but at some point, this will reduce the impedance of the interconnect and cause excessive reflection noise.
