Market leaders have adopted the SonicsMX[R] SMART Interconnect[TM] solution to improve time-to-market, reduce
design risks and leverage a high degree of platform-based design flexibility.
These IP cores are designed to improve the design time-to-market, eliminate
design risks, and reduce development costs for System-on-chip (SoC) designs.
Market leaders have adopted the Sonics SMART Interconnect solutions to improve time-to-market, reduce
design risks and leverage a high degree of platform-based design flexibility.
XC018 Master Kit for Cadence Supports CMOS Logic Low-Power Technology, Accelerates Development Time and Reduces
Design RisksMarket leaders have adopted SonicsMX to improve time-to-market, reduce
design risks, and leverage a high degree of platform-based design flexibility.
In addition, it can eliminate many weeks of error-prone manual effort, improve the QoR, and lower the
design risks.
0 and Linux development kits minimize traditional software
design risks and dramatically shorten the development process.
These IP cores are designed to improve the design time-to-market, eliminate
design risks and reduce development costs for System-on-chip (SoC) designs.
These IP cores are designed to improve the design time-to-market delay, eliminate
design risks, and reduce development costs for SoC designs.
The program reduces time-to-revenue,
design risks and system costs by providing platform ASIC designers with third-party development capabilities.
Stretch benefited from the strength of a comprehensive Cadence Digital IC design flow and libraries from Taiwan Semiconductor Manufacturing Company (TSMC), to mitigate its
design risks and ensure high quality of silicon (QoS) through improved area and performance.
Moreover, the offerings enable designers to minimizing their
design risks, reduce time to market and development cost in implementing high-performance Advanced Switching based products.
