Bonding

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Bonding

A background check on a potential employee, followed by the procurement of insurance against any theft from the company that the employee may commit. Some financial service or other companies whose employees handle large amounts of cash conduct this process. The United States Department of Labor runs the Federal Bonding Program, which issues bonds insuring or guaranteeing the insurance of ex-offenders whose employment adds significant risk of theft or fraud.
References in periodicals archive ?
HID Global is the first company that can effectively attach an antenna via its patented direct bonding technology to a chip surface less than 0.
The transmitter incorporates a hybrid III-V/Si laser-fabricated by direct bonding, which exhibits 9 nm wavelength tunability and a silicon Mach-Zehnder modulator with high extinction ratio (up to 10 dB), leading to an excellent bit-error-rate performance at 10 Gb/s.
As part of its quest to sustain a dominant market position, CPT has built a full touch supply chain in Fuzhou, China; manufacturing many components including the Touch Sensor, Touch Module, Touch Window (Cover Glass: the process of cutting, CNC Edging, Hole Drilling, Chemical Strengthening, Printing, and AR/AG/AS/AF coating), Touch TFT LCM, and direct bonding.
ZiBond(TM) Direct Bonding Process Enables Pixel Scaling, Increased Yield And Lower Production Costs in Rapidly Growing Image Sensor Markets
Metal direct bonding also gives good hermeticity and mechanical stability for many MEMS applications.
Soitec's 3D technology strategy is built on three pillars: Low-temperature Smart Cut(TM) technology, Smart Stacking(TM) technology and metal-to-metal direct bonding, currently in development.
Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
The tool incorporates EVG's patented SmartView bond aligner, which delivers high- precision aligned direct bonding.
With SUSS MicroTec's SELECT toolkit applied in both direct bonding as well as other wafer processing applications a ground-breaking new approach seems possible for device processing in the semiconductor industry.
Direct Bonding - Posterior: Number performed in 2006: 474 on average; 2.
DuPont([TM]) Vertak([TM]) Direct Bonding Display Technology to be Licensed to Leading Touch Panel Manufacturer